The bottom filling coating is epoxy resin coating on the edge of flip chip. According to the capillary effect, the glue is absorbed to the opposite side of the component to complete the bottom filling process, and then the glue is cured under heating.

　

　　nsufficient filling and gluing requirements:

　

　　The first choice for bottom filling is to heat the glue and keep the glue temperature. Therefore, the dispensing machine must have the function of heat management. The dispensing valve has a heat management component, which can manage the glue temperature well, so that the glue can be uniformly coated. In addition, the components need to be heated in the process of bottom filling and gluing, that is, the preheating of the board. Function to accelerate the capillary flow speed of glue and provide favorable guarantee for normal curing. The accuracy of temperature control can also eliminate bad phenomena such as bubbles.

 

　　In the process of bottom filling and coating, the accuracy of glue distribution is very important, especially when the RF shield has been assembled in place, the glue distribution operation needs to be carried out through the upper surface, which is very high for the glue distributor. The conventional dispensing method can not meet the requirements of filling and coating. If the injection dispensing machine is used, it can meet the requirements. Without needle withdrawal, the glue will not stop, and the glue quantity can be accurately controlled. This is the advantage of intelligent production line to choose bottom filling and coating.