Bottom filling process is to apply glue to the edge of flip chip, through the "capillary effect", the glue drops to the opposite side of the component. Fill the bottom, then the glue solidifies under heating.

 

 

What is the requirement of dispensing process at the bottom of dispensing machine?

 

 

 

 

Firstly, the glue is heated to maintain the glue temperature, so our distributor equipment must have heat management function.

 

 

 

 

Secondly, the bottom filling process needs heating, which can speed up the glue flow rate and provide a favorable guarantee for normal curing.

 

 

 

 

 

Thirdly, the bottom filling process has a high demand for dispensing accuracy, especially when the RF shield cover is assembled in place, a requirement that can only be achieved through visual dispensing machine operation on the upper surface.

 

 

 

 

 

In a word, the above is the performance requirement of bottom filling process for distributor. We must pay special attention to the process of distributing the bottom filling process.